Surface Mount  

NO

Package / Case  

DO-13

Mounting Type  

Through Hole

Number of Pins  

2

Supplier Device Package  

DO-13

Diode Element Material  

SILICON

Number of Terminals  

2

Manufacturer Part Number  

1N6054

Rohs Code  

No

Part Life Cycle Code  

Active

Ihs Manufacturer  

MICROSEMI CORP

Part Package Code  

DO-13

Package Description  

HERMETIC SEALED, METAL GLASS, DO-13, 2 PIN

Risk Rank  

5.45

Number of Elements  

1

Package Body Material  

METAL

Package Shape  

ROUND

Package Style  

LONG FORM

Power Dissipation (Max)  

1 W

Reflow Temperature-Max (s)  

NOT SPECIFIED

Product Status  

Discontinued at Digi-Key

Mfr  

Microchip Technology

Package  

Bulk

Series  

-

Operating Temperature  

-55°C ~ 175°C (TJ)

JESD-609 Code  

e0

Pbfree Code  

No

Part Status  

Production (Last Updated: 2 months ago)

ECCN Code  

EAR99

Type  

Zener

Terminal Finish  

TIN LEAD

Applications  

General Purpose

HTS Code  

8541.10.00.50

Terminal Position  

AXIAL

Terminal Form  

WIRE

Peak Reflow Temperature (Cel)  

NOT SPECIFIED

Reach Compliance Code  

unknown

JESD-30 Code  

O-MALF-W2

Qualification Status  

Not Qualified

Polarity  

BIDIRECTIONAL

Configuration  

SINGLE

Diode Type  

TRANS VOLTAGE SUPPRESSOR DIODE

Case Connection  

ISOLATED

Power Line Protection  

No

Voltage - Breakdown (Min)  

38.7V

Power - Peak Pulse  

1500W (1.5kW)

Current - Peak Pulse (10/1000μs)  

24A

Voltage - Clamping (Max) @ Ipp  

61.9V

Voltage - Reverse Standoff (Typ)  

34V

Bidirectional Channels  

1

Rep Pk Reverse Voltage-Max  

34 V

JEDEC-95 Code  

DO-202AA

Capacitance @ Frequency  

-

Non-rep Peak Rev Power Dis-Max  

1500 W

Breakdown Voltage-Min  

38.7 V

Breakdown Voltage-Max  

47.3 V