Surface Mount  

NO

Mounting Type  

Surface Mount

Package / Case  

16-UFBGA, WLCSP

Supplier Device Package  

16-WLCSP (1.41x1.41)

Diode Element Material  

SILICON

Number of Terminals  

4

Manufacturer Part Number  

BR1001-G

Rohs Code  

Yes

Part Life Cycle Code  

Active

Ihs Manufacturer  

COMCHIP TECHNOLOGY CO LTD

Package Description  

R-XUFM-D4

Risk Rank  

5.6

Number of Elements  

4

Operating Temperature-Max  

150 °C

Operating Temperature-Min  

-55 °C

Package Body Material  

UNSPECIFIED

Package Shape  

RECTANGULAR

Package Style  

FLANGE MOUNT

Reflow Temperature-Max (s)  

NOT SPECIFIED

Package  

Bulk

Base Product Number  

BR1001

Mfr  

Comchip Technology

Product Status  

Obsolete

Operating Temperature  

-55°C ~ 150°C (TJ)

Series  

-

Additional Feature  

UL RECOGNIZED

Technology  

Standard

Terminal Position  

UPPER

Terminal Form  

SOLDER LUG

Peak Reflow Temperature (Cel)  

NOT SPECIFIED

Reach Compliance Code  

compliant

Time@Peak Reflow Temperature-Max (s)  

NOT SPECIFIED

JESD-30 Code  

R-XUFM-D4

Configuration  

BRIDGE, 4 ELEMENTS

Diode Type  

BRIDGE RECTIFIER DIODE

Current - Reverse Leakage @ Vr  

10 µA @ 100 V

Voltage - Forward (Vf) (Max) @ If  

1.1 V @ 5 A

Case Connection  

ISOLATED

Output Current-Max  

10 A

Current - Average Rectified (Io)  

10 A

Number of Phases  

1

Rep Pk Reverse Voltage-Max  

100 V

Non-rep Pk Forward Current-Max  

240 A

Voltage - Peak Reverse (Max)  

100 V