Surface Mount  

YES

Number of Terminals  

8

Reflow Temperature-Max (s)  

40

Package Shape  

RECTANGULAR

Package Equivalence Code  

TSSOP8,.25

Package Code  

TSSOP

Package Body Material  

PLASTIC/EPOXY

Operating Temperature-Min  

-40 °C

Operating Temperature-Max  

85 °C

Number of Words Code  

8000

Number of Words  

8192 words

Moisture Sensitivity Levels  

1

Clock Frequency-Max (fCLK)  

2 MHz

Risk Rank  

5.23

Package Description  

TSSOP, TSSOP8,.25

Part Package Code  

SOIC

Ihs Manufacturer  

MICROCHIP TECHNOLOGY INC

Part Life Cycle Code  

Not Recommended

Rohs Code  

Yes

Manufacturer Part Number  

25LC640T-I/ST

Package Style  

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Supply Voltage-Nom (Vsup)  

5 V

JESD-609 Code  

e3

Pbfree Code  

Yes

ECCN Code  

EAR99

Terminal Finish  

Matte Tin (Sn)

Additional Feature  

1000K ERASE/WRITE CYCLES; DATA RETENTION > 200 YEARS

HTS Code  

8542.32.00.51

Terminal Position  

DUAL

Terminal Form  

GULL WING

Peak Reflow Temperature (Cel)  

260

Number of Functions  

1

Terminal Pitch  

0.65 mm

Reach Compliance Code  

compliant

Pin Count  

8

JESD-30 Code  

R-PDSO-G8

Qualification Status  

Not Qualified

Supply Voltage-Max (Vsup)  

5.5 V

Power Supplies  

3/5 V

Temperature Grade  

INDUSTRIAL

Supply Voltage-Min (Vsup)  

2.5 V

Operating Mode  

SYNCHRONOUS

Supply Current-Max  

0.005 mA

Organization  

8KX8

Seated Height-Max  

1.2 mm

Memory Width  

8

Standby Current-Max  

0.000001 A

Memory Density  

65536 bit

Parallel/Serial  

SERIAL

Memory IC Type  

EEPROM

Serial Bus Type  

SPI

Endurance  

100000 Write/Erase Cycles

Write Cycle Time-Max (tWC)  

5 ms

Data Retention Time-Min  

200

Write Protection  

HARDWARE/SOFTWARE

Width  

3 mm

Length  

4.4 mm