Surface Mount  

NO

Package / Case  

DO-35-2

Diode Element Material  

SILICON

Number of Terminals  

2

Manufacturer Part Number  

1N4618D

Rohs Code  

No

Part Life Cycle Code  

Active

Ihs Manufacturer  

MICROSEMI CORP

Package Description  

HERMETIC SEALED, GLASS PACKAGE-2

Risk Rank  

5.09

Moisture Sensitivity Levels  

1

Number of Elements  

1

Operating Temperature-Max  

200 °C

Operating Temperature-Min  

-65 °C

Package Body Material  

GLASS

Package Shape  

ROUND

Package Style  

LONG FORM

Power Dissipation (Max)  

0.5 W

Reference Voltage-Nom  

2.7 V

Reflow Temperature-Max (s)  

NOT SPECIFIED

Package  

Bulk

Mfr  

Microchip Technology

Product Status  

Active

Ir - Reverse Current  

0.5 uA

Zz - Zener Impedance  

1500 Ohms

Ir - Maximum Reverse Leakage Current  

0.5 uA

Pd - Power Dissipation  

0.5 W

Maximum Operating Temperature  

+ 175 C

Unit Weight  

0.003845 oz

Minimum Operating Temperature  

- 65 C

Factory Pack QuantityFactory Pack Quantity  

1

Mounting Styles  

Through Hole

Brand  

Microchip Technology

If - Forward Current  

200 mA

Vz - Zener Voltage  

2.7 V

RoHS  

N

Voltage Temperature Coefficient  

- 0.075 %/C

Series  

-

JESD-609 Code  

e0

Pbfree Code  

No

ECCN Code  

EAR99

Terminal Finish  

TIN LEAD

Additional Feature  

METALLURGICALLY BONDED

HTS Code  

8541.10.00.50

Terminal Position  

AXIAL

Terminal Form  

WIRE

Peak Reflow Temperature (Cel)  

NOT SPECIFIED

Reach Compliance Code  

unknown

JESD-30 Code  

O-LALF-W2

Qualification Status  

Not Qualified

Polarity  

UNIDIRECTIONAL

Configuration  

SINGLE

Diode Type  

ZENER DIODE

Case Connection  

ISOLATED

Test Current  

250 uA

Product Type  

Zener Diodes

Voltage Tol-Max  

1%

JEDEC-95 Code  

DO-35

Working Test Current  

0.25 mA

Voltage Tolerance  

1 %

Zener Current  

90 mA

Dynamic Impedance-Max  

1500 Ω

Vf - Forward Voltage  

1.1 V

Product Category  

Zener Diodes