Package / Case  

DO-213AB-2

Mounting Type  

Surface Mount

Surface Mount  

YES

Supplier Device Package  

DO-213AB

Diode Element Material  

SILICON

Number of Terminals  

2

RoHS  

N

Mounting Styles  

SMD/SMT

Factory Pack QuantityFactory Pack Quantity  

1

Unit Weight  

0.001764 oz

Package  

Bulk

Base Product Number  

CDLL5931

Impedance (Max) (Zzt)  

12 Ohms

Mfr  

Microchip Technology

Product Status  

Active

Package Description  

O-LELF-R2

Package Style  

LONG FORM

Package Body Material  

GLASS

Reflow Temperature-Max (s)  

NOT SPECIFIED

Rohs Code  

No

Manufacturer Part Number  

CDLL5931B

Power Dissipation (Max)  

1.5 W

Package Shape  

ROUND

Number of Elements  

1

Part Life Cycle Code  

Active

Ihs Manufacturer  

MICROSEMI CORP

Risk Rank  

5.38

Part Package Code  

DO-213AB

Packaging  

Bulk

Operating Temperature  

-65°C ~ 175°C

Series  

-

Tolerance  

±5%

Pbfree Code  

No

ECCN Code  

EAR99

Additional Feature  

HIGH RELIABILITY

HTS Code  

8541.10.00.50

Technology  

ZENER

Terminal Position  

END

Terminal Form  

WRAP AROUND

Peak Reflow Temperature (Cel)  

NOT SPECIFIED

Reach Compliance Code  

compliant

Pin Count  

2

Termination Style  

SMD/SMT

JESD-30 Code  

O-LELF-R2

Qualification Status  

Not Qualified

Polarity  

UNIDIRECTIONAL

Configuration  

SINGLE

Diode Type  

ZENER DIODE

Current - Reverse Leakage @ Vr  

1 µA @ 13.7 V

Voltage - Forward (Vf) (Max) @ If  

1.2 V @ 200 mA

Case Connection  

ISOLATED

Power - Max  

1.25 W

Voltage - Zener (Nom) (Vz)  

18 V

Voltage Tol-Max  

5%

JEDEC-95 Code  

DO-213AB

Working Test Current  

20.8 mA

Diameter  

2.67 mm

Length  

5.21 mm