Mounting Type  

Surface Mount

Package / Case  

325-TFBGA, FCBGA

Surface Mount  

YES

Supplier Device Package  

325-FCBGA (11x11)

Number of Terminals  

325

Shipping Restrictions  

This product may require additional documentation to export from the United States.

RoHS  

N

Moisture Sensitive  

Yes

Factory Pack QuantityFactory Pack Quantity  

176

Tradename  

IGLOO2

Number of I/Os  

200

Package  

Tray

Base Product Number  

M2GL050

Mfr  

Microchip Technology

Product Status  

Active

Package Description  

11 X 11 MM, 0.50 MM PITCH, FBGA-325

Package Style  

GRID ARRAY

Package Body Material  

PLASTIC/EPOXY

Package Equivalence Code  

BGA325,21X21,20

Supply Voltage-Nom  

1.2 V

Reflow Temperature-Max (s)  

20

Supply Voltage-Min  

1.14 V

Rohs Code  

No

Manufacturer Part Number  

M2GL050TS-FCS325I

Package Code  

BGA

Package Shape  

SQUARE

Part Life Cycle Code  

Active

Ihs Manufacturer  

MICROSEMI CORP

Supply Voltage-Max  

1.26 V

Risk Rank  

5.27

Series  

M2GL050TS

Packaging  

Tray

Operating Temperature  

-40°C ~ 100°C (TJ)

HTS Code  

8542.39.00.01

Technology  

CMOS

Voltage - Supply  

1.14V ~ 2.625V

Terminal Position  

BOTTOM

Terminal Form  

BALL

Peak Reflow Temperature (Cel)  

240

Reach Compliance Code  

compliant

JESD-30 Code  

S-PBGA-B325

Number of Outputs  

200

Qualification Status  

Not Qualified

Power Supplies  

1.2 V

Number of Inputs  

200

Programmable Logic Type  

FIELD PROGRAMMABLE GATE ARRAY

Number of Logic Elements/Cells  

56340

Total RAM Bits  

1869824

Number of Logic Cells  

56340