Package / Case  

TO-66-2

Mounting Type  

Through Hole

Surface Mount  

NO

Number of Pins  

2

Supplier Device Package  

TO-66 (TO-213AA)

Number of Terminals  

2

Transistor Element Material  

SILICON

RoHS  

N

Mounting Styles  

Through Hole

Factory Pack QuantityFactory Pack Quantity  

1

Package  

Bulk

Current-Collector (Ic) (Max)  

4 A

Base Product Number  

2N3741

Mfr  

Microchip Technology

Product Status  

Active

Package Style  

FLANGE MOUNT

Package Body Material  

METAL

Reflow Temperature-Max (s)  

NOT SPECIFIED

Part Life Cycle Code  

Active

Ihs Manufacturer  

MICROSEMI CORP

Risk Rank  

5.09

Part Package Code  

TO-66

Number of Elements  

1

Package Shape  

ROUND

Manufacturer Part Number  

2N3741A

Transition Frequency-Nom (fT)  

3 MHz

Rohs Code  

No

Operating Temperature-Max  

200 °C

Packaging  

Tray

Operating Temperature  

-65°C ~ 200°C (TJ)

Series  

-

JESD-609 Code  

e0

Pbfree Code  

No

ECCN Code  

EAR99

Terminal Finish  

Tin/Lead (Sn/Pb)

Additional Feature  

HIGH RELIABILITY

HTS Code  

8541.29.00.95

Terminal Position  

BOTTOM

Terminal Form  

PIN/PEG

Peak Reflow Temperature (Cel)  

NOT SPECIFIED

Reach Compliance Code  

not_compliant

JESD-30 Code  

O-MBFM-P2

Qualification Status  

Not Qualified

Configuration  

SINGLE

Power - Max  

25 W

Transistor Application  

SWITCHING

Polarity/Channel Type  

PNP

Transistor Type  

PNP

DC Current Gain (hFE) (Min) @ Ic, Vce  

40 @ 100mA, 1V

Current - Collector Cutoff (Max)  

1µA

JEDEC-95 Code  

TO-66

Vce Saturation (Max) @ Ib, Ic  

600mV @ 125mA, 1A

Voltage - Collector Emitter Breakdown (Max)  

80 V

Frequency - Transition  

3MHz

Power Dissipation-Max (Abs)  

25 W

Collector Current-Max (IC)  

4 A

DC Current Gain-Min (hFE)  

10

Collector-Emitter Voltage-Max  

80 V