Package / Case  

BGA-256

Surface Mount  

YES

Supplier Device Package  

256-FPBGA (14x14)

Number of Terminals  

256

RoHS  

Details

Mounting Styles  

SMD/SMT

Core  

ARM Cortex M3

Maximum Clock Frequency  

166 MHz

L1 Cache Instruction Memory  

-

L1 Cache Data Memory  

-

Data RAM Size  

64 kB

Number of Logic Elements  

6060 LE

Number of I/Os  

161 I/O

Minimum Operating Temperature  

0 C

Maximum Operating Temperature  

+ 85 C

Distributed RAM  

191 kbit

Moisture Sensitive  

Yes

Number of Logic Array Blocks - LABs  

505 LAB

Factory Pack QuantityFactory Pack Quantity  

119

Unit Weight  

0.167354 oz

Package  

Tray

Base Product Number  

M2S005

Mfr  

Microchip Technology

Product Status  

Active

Package Description  

LFBGA, BGA256,16X16,32

Package Style  

GRID ARRAY, LOW PROFILE, FINE PITCH

Moisture Sensitivity Levels  

3

Package Body Material  

PLASTIC/EPOXY

Package Equivalence Code  

BGA256,16X16,32

Supply Voltage-Nom  

1.2 V

Reflow Temperature-Max (s)  

40

Supply Voltage-Min  

1.14 V

Operating Temperature-Max  

85 °C

Rohs Code  

Yes

Manufacturer Part Number  

M2S005-VFG256

Package Code  

LFBGA

Package Shape  

SQUARE

Part Life Cycle Code  

Active

Ihs Manufacturer  

MICROSEMI CORP

Supply Voltage-Max  

1.26 V

Risk Rank  

5.77

Packaging  

Tray

Series  

SmartFusion2

Operating Temperature  

0°C ~ 85°C (TJ)

JESD-609 Code  

e1

Terminal Finish  

Tin/Silver/Copper (Sn/Ag/Cu)

Additional Feature  

LG-MIN, WD-MIN

HTS Code  

8542.39.00.01

Technology  

CMOS

Terminal Position  

BOTTOM

Terminal Form  

BALL

Peak Reflow Temperature (Cel)  

250

Terminal Pitch  

0.8 mm

Reach Compliance Code  

compliant

JESD-30 Code  

S-PBGA-B256

Number of Outputs  

161

Qualification Status  

Not Qualified

Operating Supply Voltage  

1.2 V

Power Supplies  

1.2 V

Temperature Grade  

OTHER

Speed  

166MHz

RAM Size  

64KB

Core Processor  

ARM® Cortex®-M3

Peripherals  

-

Program Memory Size  

128 kB

Connectivity  

CANbus, Ethernet, I²C, SPI, UART/USART, USB

Architecture  

MCU, FPGA

Number of Inputs  

161

Seated Height-Max  

1.56 mm

Programmable Logic Type  

FIELD PROGRAMMABLE GATE ARRAY

Speed Grade  

STD

Primary Attributes  

FPGA - 5K Logic Modules

Number of Logic Cells  

6060

Number of Cores  

1 Core

Flash Size  

128KB

Width  

14 mm

Length  

14 mm