Package / Case  

TO-66-2

Mount  

Through Hole

Surface Mount  

NO

Number of Pins  

3

Number of Terminals  

2

Transistor Element Material  

SILICON

Unit Weight  

0.283074 oz

Factory Pack QuantityFactory Pack Quantity  

1

Maximum Operating Temperature  

+ 200 C

Minimum Operating Temperature  

- 65 C

Gain Bandwidth Product fT  

-

Pd - Power Dissipation  

40 W

Maximum DC Collector Current  

7 A

Collector-Emitter Saturation Voltage  

700 mV

Emitter- Base Voltage VEBO  

6 V

Collector- Emitter Voltage VCEO Max  

100 V

Transistor Polarity  

NPN

Mounting Styles  

Through Hole

RoHS  

N

Package  

Bulk

Base Product Number  

2N5430

Mfr  

Microchip Technology

Product Status  

Active

Power Dissipation (Max)  

40 W

Package Description  

FLANGE MOUNT, O-MBFM-P2

Package Style  

FLANGE MOUNT

Package Body Material  

METAL

Reflow Temperature-Max (s)  

NOT SPECIFIED

Rohs Code  

No

Manufacturer Part Number  

2N5430

Package Shape  

ROUND

Part Life Cycle Code  

Active

Ihs Manufacturer  

MICROSEMI CORP

Risk Rank  

5.18

Part Package Code  

TO-66

Packaging  

Tray

Series  

*

JESD-609 Code  

e0

Pbfree Code  

No

ECCN Code  

EAR99

Terminal Finish  

TIN/LEAD (SN/PB)

HTS Code  

8541.29.00.95

Terminal Position  

BOTTOM

Terminal Form  

PIN/PEG

Peak Reflow Temperature (Cel)  

NOT SPECIFIED

Reach Compliance Code  

compliant

JESD-30 Code  

O-MBFM-P2

Qualification Status  

Not Qualified

Configuration  

Single

Power Dissipation  

40

Polarity/Channel Type  

NPN

Collector Emitter Voltage (VCEO)  

100 V

Max Collector Current  

7 A

JEDEC-95 Code  

TO-66

Collector Base Voltage (VCBO)  

100 V

Collector Current-Max (IC)  

7 A

DC Current Gain-Min (hFE)  

60

Continuous Collector Current  

7

Collector-Emitter Voltage-Max  

100 V

Radiation Hardening  

No