Package / Case  

400-LFBGA

Surface Mount  

YES

Supplier Device Package  

400-VFBGA (17x17)

Number of Terminals  

400

Unit Weight  

0.356867 oz

Factory Pack QuantityFactory Pack Quantity  

90

Number of Logic Array Blocks - LABs  

505 LAB

Moisture Sensitive  

Yes

Number of Logic Elements  

6060 LE

Data RAM Size  

64 kB

L1 Cache Data Memory  

-

L1 Cache Instruction Memory  

-

Maximum Clock Frequency  

166 MHz

Core  

ARM Cortex M3

RoHS  

N

Number of I/Os  

169

Package  

Tray

Base Product Number  

M2S005

Mfr  

Microchip Technology

Product Status  

Active

Package Description  

VFBGA-400

Package Style  

GRID ARRAY, LOW PROFILE, FINE PITCH

Package Body Material  

PLASTIC/EPOXY

Package Equivalence Code  

BGA400,20X20,32

Supply Voltage-Nom  

1.2 V

Reflow Temperature-Max (s)  

30

Supply Voltage-Min  

1.14 V

Rohs Code  

No

Manufacturer Part Number  

M2S005-VF400I

Package Code  

LFBGA

Package Shape  

SQUARE

Part Life Cycle Code  

Active

Ihs Manufacturer  

MICROSEMI CORP

Supply Voltage-Max  

1.26 V

Risk Rank  

5.84

Series  

SmartFusion2

Packaging  

Tray

Operating Temperature  

-40°C ~ 100°C (TJ)

JESD-609 Code  

e0

Terminal Finish  

Tin/Lead (Sn/Pb)

HTS Code  

8542.39.00.01

Technology  

CMOS

Terminal Position  

BOTTOM

Terminal Form  

BALL

Peak Reflow Temperature (Cel)  

240

Terminal Pitch  

0.8 mm

Reach Compliance Code  

not_compliant

JESD-30 Code  

S-PBGA-B400

Number of Outputs  

171

Qualification Status  

Not Qualified

Power Supplies  

1.2 V

Speed  

166MHz

RAM Size  

64KB

Core Processor  

ARM® Cortex®-M3

Peripherals  

DDR

Program Memory Size  

128 kB

Connectivity  

CANbus, Ethernet, I²C, SPI, UART/USART, USB

Architecture  

MCU, FPGA

Number of Inputs  

171

Seated Height-Max  

1.51 mm

Programmable Logic Type  

FIELD PROGRAMMABLE GATE ARRAY

Primary Attributes  

FPGA - 5K Logic Modules

Number of Logic Cells  

6060

Number of Cores  

1 Core

Flash Size  

128KB

Width  

17 mm

Length  

17 mm