Package / Case  

1152-BBGA, FCBGA

Surface Mount  

YES

Supplier Device Package  

1152-FCBGA (35x35)

Number of Terminals  

1152

Shipping Restrictions  

This product may require additional documentation to export from the United States.

RoHS  

N

Core  

ARM Cortex M3

Maximum Clock Frequency  

166 MHz

L1 Cache Instruction Memory  

-

L1 Cache Data Memory  

-

Data RAM Size  

64 kB

Number of Logic Elements  

146124 LE

Moisture Sensitive  

Yes

Number of Logic Array Blocks - LABs  

12177 LAB

Factory Pack QuantityFactory Pack Quantity  

24

Device Logic Units  

146124

Supplier Package  

FCBGA

Typical Operating Supply Voltage  

1.2 V

Minimum Operating Supply Voltage  

1.14 V

Maximum Number of User I/Os  

574

Maximum Operating Supply Voltage  

1.26 V

Mounting  

Surface Mount

Number of I/Os  

574

Package  

Tray

Base Product Number  

M2S150

Mfr  

Microchip Technology

Product Status  

Active

Package Description  

FBGA-1152

Package Style  

GRID ARRAY

Package Body Material  

PLASTIC/EPOXY

Package Equivalence Code  

BGA1152,34X34,40

Supply Voltage-Nom  

1.2 V

Reflow Temperature-Max (s)  

30

Supply Voltage-Min  

1.14 V

Operating Temperature-Max  

85 °C

Rohs Code  

No

Manufacturer Part Number  

M2S150TS-FC1152

Package Code  

BGA

Package Shape  

SQUARE

Part Life Cycle Code  

Active

Ihs Manufacturer  

MICROSEMI CORP

Supply Voltage-Max  

1.26 V

Risk Rank  

5.87

Usage Level  

Commercial grade

Packaging  

Tray

Series  

SmartFusion2

Operating Temperature  

0 to 85 °C

JESD-609 Code  

e0

Terminal Finish  

Tin/Lead (Sn/Pb)

HTS Code  

8542.39.00.01

Technology  

CMOS

Terminal Position  

BOTTOM

Terminal Form  

BALL

Peak Reflow Temperature (Cel)  

240

Terminal Pitch  

1 mm

Reach Compliance Code  

not_compliant

Pin Count  

1152

JESD-30 Code  

S-PBGA-B1152

Number of Outputs  

574

Qualification Status  

Not Qualified

Power Supplies  

1.2 V

Temperature Grade  

OTHER

Speed  

166MHz

RAM Size  

64KB

Core Processor  

ARM® Cortex®-M3

Peripherals  

DDR, PCIe, SERDES

Program Memory Size  

512 kB

Connectivity  

CANbus, Ethernet, I²C, SPI, UART/USART, USB

Architecture  

MCU, FPGA

Number of Inputs  

574

Seated Height-Max  

2.9 mm

Programmable Logic Type  

FIELD PROGRAMMABLE GATE ARRAY

Screening Level  

Commercial

Speed Grade  

STD

Primary Attributes  

FPGA - 150K Logic Modules

Number of Logic Cells  

146124

Number of Cores  

1 Core

Flash Size  

512KB

Width  

35 mm

Length  

35 mm