Package / Case  

BGA-484

Supplier Device Package  

484-FPBGA (23x23)

Shipping Restrictions  

This product may require additional documentation to export from the United States.

RoHS  

N

Mounting Styles  

SMD/SMT

Core  

ARM Cortex M3

Maximum Clock Frequency  

166 MHz

L1 Cache Instruction Memory  

-

L1 Cache Data Memory  

-

Data RAM Size  

64 kB

Number of Logic Elements  

6060 LE

Number of I/Os  

209 I/O

Minimum Operating Temperature  

0 C

Maximum Operating Temperature  

+ 85 C

Distributed RAM  

191 kbit

Embedded Block RAM - EBR  

64 kB

Moisture Sensitive  

Yes

Number of Logic Array Blocks - LABs  

505 LAB

Factory Pack QuantityFactory Pack Quantity  

60

Typical Operating Supply Voltage  

1.2000 V

Minimum Operating Supply Voltage  

1.14 V

Maximum Operating Supply Voltage  

1.26 V

Package  

Tray

Base Product Number  

M2S005

Mfr  

Microchip Technology

Product Status  

Active

Packaging  

Tray

Series  

SmartFusion2

Operating Temperature  

0 to 85 °C

Operating Supply Voltage  

1.2 V

Speed  

166MHz

RAM Size  

64KB

Core Processor  

ARM® Cortex®-M3

Peripherals  

DDR

Program Memory Size  

128 kB

Connectivity  

CANbus, Ethernet, I²C, SPI, UART/USART, USB

Architecture  

MCU, FPGA

Speed Grade  

STD

Primary Attributes  

FPGA - 5K Logic Modules

Number of Cores  

1 Core

Flash Size  

128KB