Package / Case  

DO-213AB-2

Mounting Type  

Surface Mount

Surface Mount  

YES

Supplier Device Package  

DO-213AB

Diode Element Material  

SILICON

Number of Terminals  

2

RoHS  

N

Mounting Styles  

SMD/SMT

Factory Pack QuantityFactory Pack Quantity  

1

Unit Weight  

0.004021 oz

Package  

Bulk

Base Product Number  

CDLL3031

Impedance (Max) (Zzt)  

40 Ohms

Mfr  

Microchip Technology

Product Status  

Active

Package Description  

HERMETIC SEALED, GLASS, LL41, MELF-2

Package Style  

LONG FORM

Package Body Material  

GLASS

Reflow Temperature-Max (s)  

NOT SPECIFIED

Reference Voltage-Nom  

30 V

Rohs Code  

No

Manufacturer Part Number  

CDLL3031

Power Dissipation (Max)  

1 W

Package Shape  

ROUND

Number of Elements  

1

Part Life Cycle Code  

Active

Ihs Manufacturer  

MICROSEMI CORP

Risk Rank  

5.53

Part Package Code  

DO-213AB

Packaging  

Bulk

Operating Temperature  

-55°C ~ 175°C

Series  

-

Tolerance  

±20%

JESD-609 Code  

e0

Pbfree Code  

No

ECCN Code  

EAR99

Terminal Finish  

TIN LEAD

Additional Feature  

METALLURGICALLY BONDED

HTS Code  

8541.10.00.50

Technology  

ZENER

Terminal Position  

END

Terminal Form  

WRAP AROUND

Peak Reflow Temperature (Cel)  

NOT SPECIFIED

Reach Compliance Code  

unknown

Pin Count  

2

Termination Style  

SMD/SMT

JESD-30 Code  

O-LELF-R2

Qualification Status  

Not Qualified

Polarity  

UNIDIRECTIONAL

Configuration  

SINGLE

Diode Type  

ZENER DIODE

Current - Reverse Leakage @ Vr  

500 nA @ 22.8 V

Voltage - Forward (Vf) (Max) @ If  

1.2 V @ 200 mA

Case Connection  

ISOLATED

Power - Max  

1 W

Voltage - Zener (Nom) (Vz)  

30 V

Voltage Tol-Max  

20%

JEDEC-95 Code  

DO-213AB

Working Test Current  

8.5 mA

Diameter  

2.66 mm

Length  

5.2 mm