Mounting Type  

Through Hole

Package / Case  

TO-3

Surface Mount  

NO

Supplier Device Package  

TO-3

Diode Element Material  

SILICON

Number of Terminals  

2

RoHS  

N

Vesd - Voltage ESD Contact  

-

Vesd - Voltage ESD Air Gap  

-

Factory Pack QuantityFactory Pack Quantity  

1

Package  

Bulk

Base Product Number  

LDTS30

Mfr  

Microchip Technology

Product Status  

Active

Package Style  

FLANGE MOUNT

Package Body Material  

METAL

Operating Temperature-Min  

-50 °C

Reflow Temperature-Max (s)  

NOT SPECIFIED

Operating Temperature-Max  

175 °C

Rohs Code  

No

Manufacturer Part Number  

LDTS30A

Power Dissipation (Max)  

50 W

Package Shape  

ROUND

Number of Elements  

1

Part Life Cycle Code  

Active

Ihs Manufacturer  

MICROSEMI CORP

Breakdown Voltage-Nom  

33 V

Risk Rank  

5.6

Packaging  

Tray

Operating Temperature  

-50°C ~ 175°C (TJ)

Series  

LDTS

JESD-609 Code  

e0

ECCN Code  

EAR99

Type  

Zener

Terminal Finish  

TIN LEAD

Applications  

General Purpose

HTS Code  

8541.10.00.50

Technology  

AVALANCHE

Terminal Position  

BOTTOM

Terminal Form  

PIN/PEG

Peak Reflow Temperature (Cel)  

NOT SPECIFIED

Reach Compliance Code  

unknown

JESD-30 Code  

O-MBFM-P2

Qualification Status  

Not Qualified

Polarity  

UNIDIRECTIONAL

Configuration  

SINGLE

Diode Type  

TRANS VOLTAGE SUPPRESSOR DIODE

Case Connection  

ANODE

Power Line Protection  

No

Voltage - Breakdown (Min)  

33V

Power - Peak Pulse  

3000W (3kW)

Current - Peak Pulse (10/1000μs)  

-

Voltage - Clamping (Max) @ Ipp  

48.5V

Voltage - Reverse Standoff (Typ)  

30V

Unidirectional Channels  

1

Rep Pk Reverse Voltage-Max  

30 V

JEDEC-95 Code  

TO-3

Capacitance @ Frequency  

-

Non-rep Peak Rev Power Dis-Max  

3000 W

Reverse Current-Max  

100 µA

Breakdown Voltage-Min  

33 V

Clamping Voltage-Max  

48.5 V