Package / Case  

TO-3

Mount  

Through Hole

Surface Mount  

NO

Number of Pins  

3

Number of Terminals  

2

Transistor Element Material  

SILICON

RoHS  

N

Mounting Styles  

Through Hole

Factory Pack QuantityFactory Pack Quantity  

1

Unit Weight  

0.225789 oz

Package  

Bulk

Base Product Number  

2N1702

Mfr  

Microchip Technology

Product Status  

Active

Power Dissipation (Max)  

75 W

Package Description  

FLANGE MOUNT, O-MBFM-P2

Package Style  

FLANGE MOUNT

Package Body Material  

METAL

Reflow Temperature-Max (s)  

NOT SPECIFIED

Rohs Code  

No

Manufacturer Part Number  

2N1702

Package Shape  

ROUND

Part Life Cycle Code  

Active

Ihs Manufacturer  

MICROSEMI CORP

Risk Rank  

5.48

Packaging  

Tray

Series  

*

JESD-609 Code  

e0

Pbfree Code  

No

ECCN Code  

EAR99

Terminal Finish  

TIN LEAD

HTS Code  

8541.29.00.95

Terminal Position  

BOTTOM

Terminal Form  

PIN/PEG

Peak Reflow Temperature (Cel)  

NOT SPECIFIED

Reach Compliance Code  

compliant

JESD-30 Code  

O-MBFM-P2

Qualification Status  

Not Qualified

Polarity/Channel Type  

NPN

Collector Emitter Voltage (VCEO)  

40 V

Max Collector Current  

6 A

JEDEC-95 Code  

TO-3

Collector Current-Max (IC)  

6 A

DC Current Gain-Min (hFE)  

15

Collector-Emitter Voltage-Max  

40 V

Radiation Hardening  

No