Package / Case  

FBGA

Mounting Type  

Surface Mount

Surface Mount  

YES

Supplier Device Package  

484-FPBGA (23x23)

Number of Terminals  

484

Shipping Restrictions  

This product may require additional documentation to export from the United States.

RoHS  

N

Number of Logic Elements  

11000 LE

Number of I/Os  

300 I/O

Supply Voltage-Min  

1.425 V

Minimum Operating Temperature  

0 C

Maximum Operating Temperature  

+ 70 C

Mounting Styles  

SMD/SMT

Maximum Operating Frequency  

272 MHz

Moisture Sensitive  

Yes

Factory Pack QuantityFactory Pack Quantity  

60

Tradename  

ProASIC3

Unit Weight  

0.014110 oz

Supply Voltage-Max  

1.575 V

Package  

Tray

Base Product Number  

A3P1000

Mfr  

Microchip Technology

Product Status  

Active

Package Description  

23 X 23 MM, 2.23 MM HEIGHT, 1 MM PITCH, FBGA-484

Package Style  

GRID ARRAY

Moisture Sensitivity Levels  

3

Package Body Material  

PLASTIC/EPOXY

Supply Voltage-Nom  

1.5 V

Reflow Temperature-Max (s)  

30

Operating Temperature-Max  

85 °C

Rohs Code  

No

Manufacturer Part Number  

A3P1000-1FG484

Clock Frequency-Max  

350 MHz

Package Code  

BGA

Package Shape  

SQUARE

Part Life Cycle Code  

Active

Ihs Manufacturer  

MICROSEMI CORP

Risk Rank  

5.23

Series  

A3P1000

Packaging  

Tray

Operating Temperature  

0°C ~ 85°C (TJ)

JESD-609 Code  

e0

Terminal Finish  

Tin/Lead (Sn/Pb)

HTS Code  

8542.39.00.01

Technology  

CMOS

Voltage - Supply  

1.5 V

Terminal Position  

BOTTOM

Terminal Form  

BALL

Peak Reflow Temperature (Cel)  

225

Terminal Pitch  

1 mm

Reach Compliance Code  

compliant

JESD-30 Code  

S-PBGA-B484

Qualification Status  

Not Qualified

Temperature Grade  

COMMERCIAL

Organization  

24576 CLBS, 1000000 GATES

Seated Height-Max  

2.44 mm

Programmable Logic Type  

FIELD PROGRAMMABLE GATE ARRAY

Total RAM Bits  

147456

Number of Gates  

1000000

Speed Grade  

1

Number of CLBs  

24576

Number of Equivalent Gates  

1000000

Width  

23 mm

Length  

23 mm