Package / Case  

FBGA-256

Mounting Type  

Surface Mount

Surface Mount  

YES

Supplier Device Package  

256-FPBGA (17x17)

Number of Terminals  

256

RoHS  

N

Number of Logic Elements  

-

Number of I/Os  

177 I/O

Supply Voltage-Min  

1.425 V

Minimum Operating Temperature  

0 C

Maximum Operating Temperature  

+ 85 C

Mounting Styles  

SMD/SMT

Maximum Operating Frequency  

350 MHz

Moisture Sensitive  

Yes

Factory Pack QuantityFactory Pack Quantity  

90

Tradename  

ProASIC3

Unit Weight  

0.014110 oz

Typical Operating Supply Voltage  

1.5000 V

Minimum Operating Supply Voltage  

1.425 V

Maximum Operating Supply Voltage  

1.575 V

Supply Voltage-Max  

1.575 V

Package  

Tray

Base Product Number  

A3P1000

Mfr  

Microchip Technology

Product Status  

Active

Package Description  

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256

Package Style  

GRID ARRAY

Moisture Sensitivity Levels  

3

Package Body Material  

PLASTIC/EPOXY

Supply Voltage-Nom  

1.5 V

Reflow Temperature-Max (s)  

30

Operating Temperature-Max  

85 °C

Rohs Code  

No

Manufacturer Part Number  

A3P1000-FG256

Clock Frequency-Max  

350 MHz

Package Code  

BGA

Package Shape  

SQUARE

Part Life Cycle Code  

Active

Ihs Manufacturer  

MICROSEMI CORP

Risk Rank  

1.47

Series  

A3P1000

Packaging  

Tray

Operating Temperature  

0 to 70 °C

Terminal Finish  

TIN LEAD/TIN LEAD SILVER

HTS Code  

8542.39.00.01

Technology  

CMOS

Voltage - Supply  

1.5 V

Terminal Position  

BOTTOM

Terminal Form  

BALL

Peak Reflow Temperature (Cel)  

225

Terminal Pitch  

1 mm

Reach Compliance Code  

compliant

JESD-30 Code  

S-PBGA-B256

Qualification Status  

Not Qualified

Temperature Grade  

COMMERCIAL

Organization  

24576 CLBS, 1000000 GATES

Seated Height-Max  

1.8 mm

Programmable Logic Type  

FIELD PROGRAMMABLE GATE ARRAY

Total RAM Bits  

147456

Number of Gates  

1000000

Speed Grade  

STD

Number of CLBs  

24576

Number of Equivalent Gates  

1000000

Width  

17 mm

Length  

17 mm