Surface Mount  

NO

Diode Element Material  

SILICON

Number of Terminals  

2

RoHS  

N

Maximum Diode Capacitance  

4 pF

Maximum Series Resistance @ Maximum IF  

200 mOhms

If - Forward Current  

500 mA

Minimum Operating Temperature  

- 55 C

Maximum Operating Temperature  

+ 150 C

Mounting Styles  

Through Hole

Carrier Life  

30 us

Ir - Reverse Current  

10 uA

Pd - Power Dissipation  

13 W

Factory Pack QuantityFactory Pack Quantity  

15

Vr - Reverse Voltage  

100 V

Package Description  

HERMETIC SEALED, AXIAL PACKAGE-2

Package Style  

LONG FORM

Package Body Material  

UNSPECIFIED

Manufacturer Package Code  

CASE B

Reflow Temperature-Max (s)  

NOT SPECIFIED

Operating Temperature-Max  

150 °C

Rohs Code  

No

Manufacturer Part Number  

HUM2001B

Power Dissipation (Max)  

13 W

Package Shape  

ROUND

Number of Elements  

1

Part Life Cycle Code  

Active

Ihs Manufacturer  

MICROSEMI CORP

Risk Rank  

5.16

Packaging  

Reel

JESD-609 Code  

e0

Pbfree Code  

No

ECCN Code  

EAR99

Type  

High Power Pin Diodes

Terminal Finish  

TIN LEAD

Applications  

SWITCHING

Additional Feature  

HIGH RELIABILITY

HTS Code  

8541.10.00.80

Terminal Position  

AXIAL

Terminal Form  

WIRE

Peak Reflow Temperature (Cel)  

NOT SPECIFIED

Reach Compliance Code  

unknown

Pin Count  

2

JESD-30 Code  

O-XALF-W2

Qualification Status  

Not Qualified

Configuration  

Single

Diode Type  

PIN DIODE

Case Connection  

ISOLATED

Breakdown Voltage-Min  

100 V

Reverse Test Voltage  

100 V

Diode Capacitance-Nom  

3.4 pF

Diode Capacitance-Max  

4 pF

Minority Carrier Lifetime-Nom  

30 µs

Diode Res Test Current  

500 mA

Diode Res Test Frequency  

4 MHz

Diode Forward Resistance-Max  

0.2 Ω

Vf - Forward Voltage  

0.85 V