Mounting Type  

Surface Mount

Package / Case  

SQ-MELF, C

Surface Mount  

YES

Supplier Device Package  

D-5C

Diode Element Material  

SILICON

Number of Terminals  

2

RoHS  

N

Mounting Styles  

SMD/SMT

Factory Pack QuantityFactory Pack Quantity  

1

Package  

Bulk

Base Product Number  

1N6701

Mfr  

Microchip Technology

Product Status  

Active

Package Description  

HERMETIC SEALED, GLASS, D-5C, 2 PIN

Package Style  

LONG FORM

Package Body Material  

GLASS

Reflow Temperature-Max (s)  

NOT SPECIFIED

Rohs Code  

No

Manufacturer Part Number  

1N6701US

Package Shape  

ROUND

Number of Elements  

1

Part Life Cycle Code  

Active

Ihs Manufacturer  

MICROSEMI CORP

Risk Rank  

5.48

Packaging  

Bulk

Series  

-

JESD-609 Code  

e0

Pbfree Code  

No

ECCN Code  

EAR99

Terminal Finish  

TIN LEAD

Applications  

GENERAL PURPOSE

Additional Feature  

METALLURGICALLY BONDED

HTS Code  

8541.10.00.80

Terminal Position  

END

Terminal Form  

WRAP AROUND

Peak Reflow Temperature (Cel)  

NOT SPECIFIED

Reach Compliance Code  

unknown

Pin Count  

2

JESD-30 Code  

O-LELF-R2

Qualification Status  

Not Qualified

Configuration  

SINGLE

Speed  

Fast Recovery =< 500ns, > 200mA (Io)

Diode Type  

RECTIFIER DIODE

Current - Reverse Leakage @ Vr  

200 µA @ 30 V

Voltage - Forward (Vf) (Max) @ If  

470 mV @ 5 A

Case Connection  

ISOLATED

Operating Temperature - Junction  

-65°C ~ 125°C

Output Current-Max  

5 A

Voltage - DC Reverse (Vr) (Max)  

30 V

Current - Average Rectified (Io)  

5A

Number of Phases  

1

Capacitance @ Vr, F  

-