Package / Case  

DO-35-2

Mounting Type  

Through Hole

Surface Mount  

NO

Supplier Device Package  

DO-35

Diode Element Material  

SILICON

Number of Terminals  

2

RoHS  

N

Mounting Styles  

Through Hole

Factory Pack QuantityFactory Pack Quantity  

1

Unit Weight  

0.005291 oz

Package  

Bulk

Base Product Number  

1N5994

Impedance (Max) (Zzt)  

25 Ohms

Mfr  

Microchip Technology

Product Status  

Active

Package Description  

HERMETIC SEALED, GLASS, DO-35, 2 PIN

Package Style  

LONG FORM

Moisture Sensitivity Levels  

1

Package Body Material  

GLASS

Reflow Temperature-Max (s)  

NOT SPECIFIED

Reference Voltage-Nom  

5.6 V

Operating Temperature-Max  

200 °C

Rohs Code  

No

Manufacturer Part Number  

1N5994C

Power Dissipation (Max)  

0.48 W

Package Shape  

ROUND

Number of Elements  

1

Part Life Cycle Code  

Active

Ihs Manufacturer  

MICROSEMI CORP

Risk Rank  

5.34

Part Package Code  

DO-35

Packaging  

Bulk

Operating Temperature  

-65°C ~ 175°C

Series  

-

Tolerance  

±2%

JESD-609 Code  

e0

Pbfree Code  

No

ECCN Code  

EAR99

Terminal Finish  

TIN LEAD

HTS Code  

8541.10.00.50

Technology  

ZENER

Terminal Position  

AXIAL

Terminal Form  

WIRE

Peak Reflow Temperature (Cel)  

NOT SPECIFIED

Reach Compliance Code  

unknown

Pin Count  

2

JESD-30 Code  

O-LALF-W2

Qualification Status  

Not Qualified

Polarity  

UNIDIRECTIONAL

Configuration  

SINGLE

Diode Type  

ZENER DIODE

Current - Reverse Leakage @ Vr  

2 µA @ 3 V

Voltage - Forward (Vf) (Max) @ If  

1.1 V @ 200 mA

Case Connection  

ISOLATED

Power - Max  

500 mW

Voltage - Zener (Nom) (Vz)  

5.6 V

Voltage Tol-Max  

2%

JEDEC-95 Code  

DO-204AH

Working Test Current  

5 mA

Dynamic Impedance-Max  

25 Ω