Package / Case  

DO-35-2

Mounting Type  

Through Hole

Surface Mount  

NO

Number of Pins  

2

Supplier Device Package  

DO-35

Diode Element Material  

SILICON

Number of Terminals  

2

RoHS  

N

Mounting Styles  

Through Hole

Factory Pack QuantityFactory Pack Quantity  

1

Unit Weight  

0.005291 oz

Package  

Bulk

Base Product Number  

1N709

Impedance (Max) (Zzt)  

4.1 Ohms

Mfr  

Microchip Technology

Product Status  

Active

Package Description  

O-XALF-W2

Package Style  

LONG FORM

Package Body Material  

UNSPECIFIED

Reflow Temperature-Max (s)  

NOT SPECIFIED

Reference Voltage-Nom  

6.2 V

Rohs Code  

No

Manufacturer Part Number  

1N709

Power Dissipation (Max)  

0.25 W

Package Shape  

ROUND

Number of Elements  

1

Part Life Cycle Code  

Active

Ihs Manufacturer  

MICROSEMI CORP

Risk Rank  

5.61

Part Package Code  

DO-35

Packaging  

Bulk

Operating Temperature  

-

Series  

-

Tolerance  

±10%

JESD-609 Code  

e0

Pbfree Code  

No

ECCN Code  

EAR99

Terminal Finish  

Tin/Lead (Sn/Pb)

HTS Code  

8541.10.00.50

Technology  

ZENER

Terminal Position  

AXIAL

Terminal Form  

WIRE

Peak Reflow Temperature (Cel)  

NOT SPECIFIED

Reach Compliance Code  

not_compliant

JESD-30 Code  

O-XALF-W2

Qualification Status  

Not Qualified

Polarity  

UNIDIRECTIONAL

Configuration  

SINGLE

Diode Type  

ZENER DIODE

Case Connection  

ISOLATED

Power - Max  

250 mW

Voltage - Zener (Nom) (Vz)  

6.2 V

Voltage Tol-Max  

10%

JEDEC-95 Code  

DO-35

Working Test Current  

25 mA