Lifecycle Status  

Production (Last Updated: 1 month ago)

Mount  

Stud

Mounting Type  

Stud Mount

Package / Case  

DO-203AB, DO-5, Stud

Surface Mount  

NO

Number of Pins  

2

Supplier Device Package  

DO-5

Diode Element Material  

SILICON

Number of Terminals  

1

RoHS  

N

Mounting Styles  

SMD/SMT

Factory Pack QuantityFactory Pack Quantity  

1

Package  

Bulk

Base Product Number  

1N5833

Mfr  

Microchip Technology

Product Status  

Active

Package Description  

O-MUPM-D1

Package Style  

POST/STUD MOUNT

Package Body Material  

METAL

Operating Temperature-Min  

-55 °C

Reflow Temperature-Max (s)  

NOT SPECIFIED

Operating Temperature-Max  

150 °C

Rohs Code  

Yes

Manufacturer Part Number  

1N5833

Package Shape  

ROUND

Number of Elements  

1

Part Life Cycle Code  

Contact Manufacturer

Ihs Manufacturer  

GENESIC SEMICONDUCTOR INC

Forward Voltage-Max (VF)  

0.7 V

Risk Rank  

5.43

Packaging  

Tray

Series  

-

Pbfree Code  

Yes

Max Operating Temperature  

125 °C

Min Operating Temperature  

-65 °C

Applications  

POWER

Terminal Position  

UPPER

Terminal Form  

SOLDER LUG

Peak Reflow Temperature (Cel)  

NOT SPECIFIED

Reach Compliance Code  

compliant

JESD-30 Code  

O-MUPM-D1

Configuration  

SINGLE

Element Configuration  

Single

Speed  

Fast Recovery =< 500ns, > 200mA (Io)

Diode Type  

RECTIFIER DIODE

Current - Reverse Leakage @ Vr  

20 mA @ 30 V

Voltage - Forward (Vf) (Max) @ If  

550 mV @ 40 A

Case Connection  

CATHODE

Forward Current  

40 A

Operating Temperature - Junction  

-65°C ~ 125°C

Output Current-Max  

40 A

Voltage - DC Reverse (Vr) (Max)  

30 V

Current - Average Rectified (Io)  

40A

Number of Phases  

1

Peak Reverse Current  

20 mA

Max Repetitive Reverse Voltage (Vrrm)  

30 V

Rep Pk Reverse Voltage-Max  

30 V

JEDEC-95 Code  

DO-203AB

Capacitance @ Vr, F  

-

Peak Non-Repetitive Surge Current  

800 A

Non-rep Pk Forward Current-Max  

800 A

Reverse Current-Max  

1000 µA

Radiation Hardening  

No