Lifecycle Status  

Production (Last Updated: 1 month ago)

Mount  

Surface Mount

Mounting Type  

Surface Mount

Package / Case  

484-BGA

Surface Mount  

YES

Supplier Device Package  

484-FPBGA (23x23)

Number of Terminals  

484

Shipping Restrictions  

This product may require additional documentation to export from the United States.

RoHS  

N

Moisture Sensitive  

Yes

Factory Pack QuantityFactory Pack Quantity  

60

Tradename  

Fusion

Number of I/Os  

172

Package  

Tray

Base Product Number  

M1AFS600

Mfr  

Microchip Technology

Product Status  

Active

Package Description  

BGA, BGA484,22X22,40

Package Style  

GRID ARRAY

Moisture Sensitivity Levels  

3

Package Body Material  

PLASTIC/EPOXY

Package Equivalence Code  

BGA484,22X22,40

Reflow Temperature-Max (s)  

20

Rohs Code  

No

Manufacturer Part Number  

M1AFS600-FG484K

Clock Frequency-Max  

350 MHz

Package Code  

BGA

Package Shape  

SQUARE

Part Life Cycle Code  

Active

Ihs Manufacturer  

MICROSEMI CORP

Risk Rank  

5.87

Series  

M1AFS600

Packaging  

Tray

Operating Temperature  

-55°C ~ 100°C (TJ)

JESD-609 Code  

e0

Terminal Finish  

Tin/Lead (Sn/Pb)

Max Operating Temperature  

100 °C

Min Operating Temperature  

-55 °C

HTS Code  

8542.39.00.01

Technology  

CMOS

Voltage - Supply  

1.425V ~ 1.575V

Terminal Position  

BOTTOM

Terminal Form  

BALL

Peak Reflow Temperature (Cel)  

225

Terminal Pitch  

1 mm

Reach Compliance Code  

compliant

JESD-30 Code  

S-PBGA-B484

Number of Outputs  

172

Qualification Status  

Not Qualified

Power Supplies  

1.5,3.3 V

RAM Size  

13.5 kB

Number of Inputs  

172

Programmable Logic Type  

FIELD PROGRAMMABLE GATE ARRAY

Total RAM Bits  

110592

Number of Gates  

600000

Number of Logic Cells  

13824