Package / Case  

FPBGA-256

Mounting Type  

Surface Mount

Surface Mount  

YES

Supplier Device Package  

256-FPBGA (17x17)

Number of Terminals  

256

Shipping Restrictions  

This product may require additional documentation to export from the United States.

RoHS  

N

Mounting Styles  

SMD/SMT

Moisture Sensitive  

Yes

Factory Pack QuantityFactory Pack Quantity  

90

Tradename  

ProASIC3

Number of I/Os  

178

Package  

Tray

Base Product Number  

M1A3P400

Mfr  

Microchip Technology

Product Status  

Active

Package Description  

17 X 17 MM, 1.60 MM HEIGHT, 1 MM PITCH, FBGA-256

Package Style  

GRID ARRAY

Moisture Sensitivity Levels  

3

Package Body Material  

PLASTIC/EPOXY

Supply Voltage-Nom  

1.5 V

Reflow Temperature-Max (s)  

30

Supply Voltage-Min  

1.425 V

Operating Temperature-Max  

85 °C

Rohs Code  

No

Manufacturer Part Number  

M1A3P400-FG256

Clock Frequency-Max  

350 MHz

Package Code  

BGA

Package Shape  

SQUARE

Part Life Cycle Code  

Active

Ihs Manufacturer  

MICROSEMI CORP

Supply Voltage-Max  

1.575 V

Risk Rank  

5.24

Series  

M1A3P400

Packaging  

Tray

Operating Temperature  

0°C ~ 85°C (TJ)

Terminal Finish  

TIN LEAD/TIN LEAD SILVER

HTS Code  

8542.39.00.01

Technology  

CMOS

Voltage - Supply  

1.425V ~ 1.575V

Terminal Position  

BOTTOM

Terminal Form  

BALL

Peak Reflow Temperature (Cel)  

225

Terminal Pitch  

1 mm

Reach Compliance Code  

compliant

JESD-30 Code  

S-PBGA-B256

Qualification Status  

Not Qualified

Temperature Grade  

COMMERCIAL

Organization  

9216 CLBS, 400000 GATES

Seated Height-Max  

1.8 mm

Programmable Logic Type  

FIELD PROGRAMMABLE GATE ARRAY

Total RAM Bits  

55296

Number of Gates  

400000

Number of CLBs  

9216

Number of Equivalent Gates  

400000

Width  

17 mm

Length  

17 mm