Package / Case  

FCSG-325

Supplier Device Package  

325-LFBGA (11x14.5)

Shipping Restrictions  

This product may require additional documentation to export from the United States.

Mounting Styles  

SMD/SMT

Core  

RV64GC, RV64IMAC

Maximum Clock Frequency  

667 MHz, 667 MHz

L1 Cache Instruction Memory  

16 kB, 4 x 32 kB

L1 Cache Data Memory  

4 x 32 kB

Data RAM Size  

-

Number of Logic Elements  

93000 LE

Number of I/Os  

276 I/O

Minimum Operating Temperature  

0 C

Maximum Operating Temperature  

+ 100 C

Factory Pack QuantityFactory Pack Quantity  

1

Package  

Bulk

Mfr  

Microchip Technology

Product Status  

Active

Packaging  

Tray

Operating Temperature  

-40°C ~ 100°C

Series  

-

Operating Supply Voltage  

1 V

Speed  

-

RAM Size  

857.6kB

Core Processor  

RISC-V

Peripherals  

DMA, PCI, PWM

Program Memory Size  

-

Connectivity  

CAN, Ethernet, I²C, MMC, QSPI, SPI, UART/USART, USB OTG

Architecture  

MPU, FPGA

Primary Attributes  

FPGA - 93K Logic Modules

Number of Cores  

5 Core

Flash Size  

128KB