Surface Mount  

YES

Number of Terminals  

8

Package Description  

TSSOP, TSSOP8,.25

Package Style  

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Moisture Sensitivity Levels  

1

Number of Words Code  

512

Package Body Material  

PLASTIC/EPOXY

Part Package Code  

SOIC

Risk Rank  

5.38

Ihs Manufacturer  

MICROCHIP TECHNOLOGY INC

Part Life Cycle Code  

Not Recommended

Manufacturer  

Microchip Technology Inc

Package Shape  

RECTANGULAR

Package Code  

TSSOP

Supply Voltage-Nom (Vsup)  

5 V

Number of Words  

512 words

Clock Frequency-Max (fCLK)  

3 MHz

Manufacturer Part Number  

25C040X-E/ST

Rohs Code  

Yes

Operating Temperature-Max  

125 °C

Reflow Temperature-Max (s)  

40

Operating Temperature-Min  

-40 °C

Package Equivalence Code  

TSSOP8,.25

JESD-609 Code  

e3

Pbfree Code  

Yes

ECCN Code  

EAR99

Terminal Finish  

Matte Tin (Sn)

Additional Feature  

DATA RETENTION > 200 YEARS; 1M ENDURANCE CYCLES

HTS Code  

8542.32.00.51

Subcategory  

EEPROMs

Technology  

CMOS

Terminal Position  

DUAL

Terminal Form  

GULL WING

Peak Reflow Temperature (Cel)  

260

Number of Functions  

1

Terminal Pitch  

0.65 mm

Reach Compliance Code  

compliant

Pin Count  

8

JESD-30 Code  

R-PDSO-G8

Qualification Status  

Not Qualified

Supply Voltage-Max (Vsup)  

5.5 V

Power Supplies  

5 V

Temperature Grade  

AUTOMOTIVE

Supply Voltage-Min (Vsup)  

4.5 V

Operating Mode  

SYNCHRONOUS

Supply Current-Max  

0.005 mA

Organization  

512X8

Seated Height-Max  

1.2 mm

Memory Width  

8

Standby Current-Max  

0.000001 A

Memory Density  

4096 bit

Parallel/Serial  

SERIAL

Memory IC Type  

EEPROM

Serial Bus Type  

SPI

Endurance  

1000000 Write/Erase Cycles

Write Cycle Time-Max (tWC)  

5 ms

Data Retention Time-Min  

200

Write Protection  

HARDWARE/SOFTWARE

Width  

3 mm

Length  

4.4 mm