Surface Mount  

YES

Number of Pins  

8

Number of Terminals  

8

Package Description  

TSSOP, TSSOP8,.25

Package Style  

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Moisture Sensitivity Levels  

1

Number of Words Code  

512

Package Body Material  

PLASTIC/EPOXY

Package Equivalence Code  

TSSOP8,.25

Operating Temperature-Min  

-40 °C

Reflow Temperature-Max (s)  

40

Operating Temperature-Max  

125 °C

Rohs Code  

Yes

Manufacturer Part Number  

25C040X-E/ST

Clock Frequency-Max (fCLK)  

3 MHz

Number of Words  

512 words

Supply Voltage-Nom (Vsup)  

5 V

Package Code  

TSSOP

Package Shape  

RECTANGULAR

Manufacturer  

Microchip Technology Inc

Part Life Cycle Code  

Not Recommended

Ihs Manufacturer  

MICROCHIP TECHNOLOGY INC

Risk Rank  

5.38

Part Package Code  

SOIC

JESD-609 Code  

e3

Pbfree Code  

Yes

ECCN Code  

EAR99

Terminal Finish  

Matte Tin (Sn)

Additional Feature  

DATA RETENTION > 200 YEARS; 1M ENDURANCE CYCLES

HTS Code  

8542.32.00.51

Subcategory  

EEPROMs

Technology  

CMOS

Terminal Position  

DUAL

Terminal Form  

GULL WING

Peak Reflow Temperature (Cel)  

260

Number of Functions  

1

Terminal Pitch  

0.65 mm

Reach Compliance Code  

compliant

JESD-30 Code  

R-PDSO-G8

Qualification Status  

Not Qualified

Power Supplies  

5 V

Temperature Grade  

AUTOMOTIVE

Operating Mode  

SYNCHRONOUS

Supply Current-Max  

0.005 mA

Organization  

512X8

Seated Height-Max  

1.2 mm

Memory Width  

8

Standby Current-Max  

0.000001 A

Memory Density  

4096 bit

Parallel/Serial  

SERIAL

Memory IC Type  

EEPROM

Serial Bus Type  

SPI

Endurance  

1000000 Write/Erase Cycles

Write Cycle Time-Max (tWC)  

5 ms

Data Retention Time-Min  

200

Write Protection  

HARDWARE/SOFTWARE

Voltage - Supply (Max)  

5.5 V

Voltage - Supply (Min)  

4.5 V

Width  

3 mm

Length  

4.4 mm