Surface Mount  

YES

Number of Terminals  

8

Package Description  

SOP, SOP8,.3

Package Style  

SMALL OUTLINE

Number of Words Code  

256

Package Body Material  

PLASTIC/EPOXY

Package Equivalence Code  

SOP8,.3

Reflow Temperature-Max (s)  

40

Operating Temperature-Max  

70 °C

Rohs Code  

Yes

Manufacturer Part Number  

93LC56A/SM

Clock Frequency-Max (fCLK)  

2 MHz

Number of Words  

256 words

Supply Voltage-Nom (Vsup)  

3 V

Package Code  

SOP

Package Shape  

RECTANGULAR

Manufacturer  

Microchip Technology Inc

Part Life Cycle Code  

Active

Ihs Manufacturer  

MICROCHIP TECHNOLOGY INC

Risk Rank  

5.17

Part Package Code  

SOIC

JESD-609 Code  

e3

Pbfree Code  

Yes

ECCN Code  

EAR99

Terminal Finish  

Matte Tin (Sn)

Additional Feature  

1000000 ERASE/WRITE CYCLES MIN; DATA RETENTION > 200 YEARS

HTS Code  

8542.32.00.51

Subcategory  

EEPROMs

Technology  

CMOS

Terminal Position  

DUAL

Terminal Form  

GULL WING

Peak Reflow Temperature (Cel)  

260

Number of Functions  

1

Terminal Pitch  

1.27 mm

Reach Compliance Code  

compliant

Pin Count  

8

JESD-30 Code  

R-PDSO-G8

Qualification Status  

Not Qualified

Supply Voltage-Max (Vsup)  

6 V

Power Supplies  

3/5 V

Temperature Grade  

COMMERCIAL

Supply Voltage-Min (Vsup)  

2.5 V

Operating Mode  

SYNCHRONOUS

Supply Current-Max  

0.0015 mA

Organization  

256X8

Seated Height-Max  

2.03 mm

Memory Width  

8

Standby Current-Max  

0.000001 A

Memory Density  

2048 bit

Parallel/Serial  

SERIAL

Memory IC Type  

EEPROM

Serial Bus Type  

MICROWIRE

Endurance  

1000000 Write/Erase Cycles

Write Cycle Time-Max (tWC)  

6 ms

Data Retention Time-Min  

200

Write Protection  

SOFTWARE

Width  

5.2 mm

Length  

5.28 mm