Surface Mount  

YES

Number of Terminals  

24

Package Description  

HVQCCN,

Package Style  

CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

Moisture Sensitivity Levels  

2

Package Body Material  

UNSPECIFIED

Manufacturer Package Code  

MLF

Operating Temperature-Min  

-40 °C

Supply Voltage-Nom  

3.3 V

Reflow Temperature-Max (s)  

30

Operating Temperature-Max  

105 °C

Rohs Code  

No

Manufacturer Part Number  

MIC3001BML

Package Code  

HVQCCN

Package Shape  

SQUARE

Manufacturer  

Microchip Technology Inc

Part Life Cycle Code  

Obsolete

Ihs Manufacturer  

MICREL INC

Risk Rank  

5.26

Part Package Code  

DFN

JESD-609 Code  

e0

Terminal Finish  

Tin/Lead (Sn85Pb15)

Applications  

SONET;SDH

HTS Code  

8542.39.00.01

Terminal Position  

QUAD

Terminal Form  

NO LEAD

Peak Reflow Temperature (Cel)  

240

Number of Functions  

1

Terminal Pitch  

0.5 mm

Reach Compliance Code  

not_compliant

Pin Count  

24

JESD-30 Code  

S-XQCC-N24

Qualification Status  

Not Qualified

Temperature Grade  

INDUSTRIAL

Seated Height-Max  

0.9 mm

Telecom IC Type  

ATM/SONET/SDH SUPPORT CIRCUIT

Width  

4 mm

Length  

4 mm