Factory Lead Time  

8 Weeks

Surface Mount  

YES

Package / Case  

BGA-165

Number of Pins  

165

Number of Terminals  

165

Package Description  

LBGA,

Package Style  

GRID ARRAY, LOW PROFILE

Number of Words Code  

256000

Package Body Material  

PLASTIC/EPOXY

Reflow Temperature-Max (s)  

NOT SPECIFIED

Operating Temperature-Max  

70 °C

Rohs Code  

No

Manufacturer Part Number  

GS88132CD-250

Number of Words  

262144 words

Supply Voltage-Nom (Vsup)  

3.3 V

Package Code  

LBGA

Package Shape  

RECTANGULAR

Manufacturer  

GSI Technology

Part Life Cycle Code  

Active

Ihs Manufacturer  

GSI TECHNOLOGY

Risk Rank  

5.16

Part Package Code  

BGA

Maximum Clock Frequency  

250 MHz

Maximum Operating Temperature  

+ 70 C

Supply Voltage-Max  

3.6 V

Minimum Operating Temperature  

0 C

Supply Voltage-Min  

2.3 V

Mounting Styles  

SMD/SMT

Interface Type  

Parallel

Series  

GS88132CD

ECCN Code  

3A991.B.2.B

Additional Feature  

ALSO OPERATES WITH 2.3V TO 2.7V SUPPLY, FLOW THROUGH OR PIPELINED ARCHITECTURE

HTS Code  

8542.32.00.41

Technology  

CMOS

Terminal Position  

BOTTOM

Terminal Form  

BALL

Peak Reflow Temperature (Cel)  

NOT SPECIFIED

Number of Functions  

1

Terminal Pitch  

1 mm

Reach Compliance Code  

compliant

JESD-30 Code  

R-PBGA-B165

Qualification Status  

Not Qualified

Temperature Grade  

COMMERCIAL

Memory Size  

9 Mbit

Operating Mode  

SYNCHRONOUS

Supply Current-Max  

155 mA, 195 mA

Access Time  

5.5 ns

Organization  

256KX32

Seated Height-Max  

1.4 mm

Memory Width  

32

Memory Density  

9

Parallel/Serial  

SERIAL

Memory IC Type  

CACHE SRAM

Voltage - Supply (Max)  

3.6 V

Voltage - Supply (Min)  

3 V

Width  

13 mm

Length  

15 mm