Package / Case  

B, Axial

Mounting Type  

Through Hole

Surface Mount  

NO

Supplier Device Package  

B, Axial

Diode Element Material  

SILICON

Number of Terminals  

2

Impedance (Max) (Zzt)  

190 Ohms

Product Status  

Active

Package  

Bulk

Mfr  

Microchip Technology

Factory Pack QuantityFactory Pack Quantity  

1

Mounting Styles  

Through Hole

Manufacturer  

Microchip

Brand  

Microchip Technology

RoHS  

N

Package Style  

LONG FORM

Package Body Material  

GLASS

Operating Temperature-Min  

-65 °C

Reflow Temperature-Max (s)  

NOT SPECIFIED

Reference Voltage-Nom  

130 V

Operating Temperature-Max  

175 °C

Rohs Code  

No

Manufacturer Part Number  

UZ5113

Power Dissipation (Max)  

5 W

Package Shape  

ROUND

Number of Elements  

1

Part Life Cycle Code  

Obsolete

Ihs Manufacturer  

MICROSEMI CORP

Risk Rank  

5.92

Series  

-

Operating Temperature  

-65°C ~ 175°C

Tolerance  

±5%

ECCN Code  

EAR99

Additional Feature  

METALLURGICALLY BONDED

HTS Code  

8541.10.00.50

Subcategory  

Diodes & Rectifiers

Technology  

ZENER

Terminal Position  

AXIAL

Terminal Form  

WIRE

Peak Reflow Temperature (Cel)  

NOT SPECIFIED

Reach Compliance Code  

unknown

Termination Style  

Axial

JESD-30 Code  

O-LALF-W2

Qualification Status  

Not Qualified

Polarity  

UNIDIRECTIONAL

Configuration  

SINGLE

Diode Type  

ZENER DIODE

Current - Reverse Leakage @ Vr  

5 μA @ 98.8 V

Case Connection  

ISOLATED

Power - Max  

5 W

Voltage - Zener (Nom) (Vz)  

130 V

Product Type  

Zener Diodes

Voltage Tol-Max  

5%

Working Test Current  

10 mA

Reverse Current-Max  

5 µA

Dynamic Impedance-Max  

190 Ω

Voltage Temp Coeff-Max  

136.5 mV/°C

Product Category  

Zener Diodes

Length  

4.4 mm

Diameter  

3.68 mm