Mounting Type  

Stud Mount

Package / Case  

TO-211MA, TO-210AC, TO-61-4, Stud

Surface Mount  

NO

Number of Pins  

3

Supplier Device Package  

TO-61

Number of Terminals  

3

Transistor Element Material  

SILICON

Current-Collector (Ic) (Max)  

20 A

Product Status  

Active

Mfr  

Microchip Technology

Factory Pack QuantityFactory Pack Quantity  

1

Manufacturer  

Microchip

Brand  

Microchip Technology

Package Description  

POST/STUD MOUNT, O-MUPM-X3

Package Style  

POST/STUD MOUNT

Package Body Material  

METAL

Reflow Temperature-Max (s)  

NOT SPECIFIED

Rohs Code  

No

Manufacturer Part Number  

2N5330

Package Shape  

ROUND

Number of Elements  

1

Part Life Cycle Code  

Active

Ihs Manufacturer  

MICROSEMI CORP

Risk Rank  

5.48

Part Package Code  

TO-61

Operating Temperature  

-65°C ~ 200°C (TJ)

JESD-609 Code  

e0

Pbfree Code  

No

ECCN Code  

EAR99

Terminal Finish  

TIN LEAD

HTS Code  

8541.29.00.95

Subcategory  

Transistors

Terminal Position  

UPPER

Terminal Form  

UNSPECIFIED

Peak Reflow Temperature (Cel)  

NOT SPECIFIED

Reach Compliance Code  

compliant

JESD-30 Code  

O-MUPM-X3

Qualification Status  

Not Qualified

Configuration  

SINGLE

Case Connection  

ISOLATED

Power - Max  

140 W

Polarity/Channel Type  

NPN

Product Type  

BJTs - Bipolar Transistors

Transistor Type  

PNP

DC Current Gain (hFE) (Min) @ Ic, Vce  

-

Current - Collector Cutoff (Max)  

-

JEDEC-95 Code  

TO-61

Vce Saturation (Max) @ Ib, Ic  

1.8V @ 2mA, 10mA

Voltage - Collector Emitter Breakdown (Max)  

90 V

Frequency - Transition  

-

Collector Current-Max (IC)  

20 A

DC Current Gain-Min (hFE)  

40

Collector-Emitter Voltage-Max  

90 V

Product Category  

Bipolar Transistors - BJT