Mounting Type  

Stud Mount

Package / Case  

TO-210AA, TO-59-4, Stud

Mount  

Stud

Number of Pins  

3

Supplier Device Package  

TO-59

Number of Terminals  

3

Transistor Element Material  

SILICON

Mfr  

Microchip Technology

Package  

Bulk

Product Status  

Active

Current-Collector (Ic) (Max)  

2 A

RoHS  

Non-Compliant

Factory Pack QuantityFactory Pack Quantity  

1

Manufacturer  

Microchip

Brand  

Microchip Technology

Package Description  

POST/STUD MOUNT, O-MUPM-X3

Package Style  

POST/STUD MOUNT

Package Body Material  

METAL

Manufacturer Part Number  

2N4998

Package Shape  

ROUND

Part Life Cycle Code  

Active

Ihs Manufacturer  

NEW JERSEY SEMICONDUCTOR PRODUCTS INC

Risk Rank  

5.77

Series  

-

Operating Temperature  

-65°C ~ 200°C (TJ)

Subcategory  

Transistors

Max Power Dissipation  

35 W

Terminal Position  

UPPER

Terminal Form  

UNSPECIFIED

Reach Compliance Code  

unknown

JESD-30 Code  

O-MUPM-X3

Polarity  

NPN

Power Dissipation  

35 W

Power - Max  

35 W

Polarity/Channel Type  

NPN

Product Type  

BJTs - Bipolar Transistors

Transistor Type  

NPN

Collector Emitter Voltage (VCEO)  

80 V

Max Collector Current  

2 A

DC Current Gain (hFE) (Min) @ Ic, Vce  

-

Current - Collector Cutoff (Max)  

-

Vce Saturation (Max) @ Ib, Ic  

850mV @ 200μA, 1mA

Voltage - Collector Emitter Breakdown (Max)  

80 V

Frequency - Transition  

-

Collector Current-Max (IC)  

2 A

Collector-Emitter Voltage-Max  

80 V

Product Category  

Bipolar Transistors - BJT

Radiation Hardening  

No