Package / Case  

B, Axial

Mounting Type  

Through Hole

Surface Mount  

NO

Supplier Device Package  

B, Axial

Diode Element Material  

SILICON

Number of Terminals  

2

Impedance (Max) (Zzt)  

2.5 Ohms

Product Status  

Active

Package  

Bulk

Mfr  

Microchip Technology

Factory Pack QuantityFactory Pack Quantity  

1

Manufacturer  

Microchip

Brand  

Microchip Technology

RoHS  

N

Package Style  

LONG FORM

Package Body Material  

GLASS

Operating Temperature-Min  

-65 °C

Reflow Temperature-Max (s)  

NOT SPECIFIED

Reference Voltage-Nom  

12 V

Operating Temperature-Max  

175 °C

Rohs Code  

No

Manufacturer Part Number  

UZ5812

Power Dissipation (Max)  

5 W

Package Shape  

ROUND

Number of Elements  

1

Part Life Cycle Code  

Obsolete

Ihs Manufacturer  

MICROSEMI CORP

Risk Rank  

5.86

Operating Temperature  

-65°C ~ 175°C

Series  

-

Tolerance  

±10%

ECCN Code  

EAR99

Additional Feature  

METALLURGICALLY BONDED

HTS Code  

8541.10.00.50

Subcategory  

Diodes & Rectifiers

Technology  

ZENER

Terminal Position  

AXIAL

Terminal Form  

WIRE

Peak Reflow Temperature (Cel)  

NOT SPECIFIED

Reach Compliance Code  

unknown

JESD-30 Code  

O-LALF-W2

Qualification Status  

Not Qualified

Polarity  

UNIDIRECTIONAL

Configuration  

SINGLE

Diode Type  

ZENER DIODE

Current - Reverse Leakage @ Vr  

50 μA @ 8.6 V

Case Connection  

ISOLATED

Power - Max  

5 W

Voltage - Zener (Nom) (Vz)  

12 V

Product Type  

Zener Diodes

Voltage Tol-Max  

10%

Working Test Current  

100 mA

Reverse Current-Max  

50 µA

Dynamic Impedance-Max  

2.5 Ω

Voltage Temp Coeff-Max  

8.4 mV/°C

Product Category  

Zener Diodes