Package / Case  

B, Axial

Mounting Type  

Through Hole

Mount  

Through Hole

Surface Mount  

NO

Number of Pins  

2

Supplier Device Package  

B, Axial

Diode Element Material  

SILICON

Number of Terminals  

2

Impedance (Max) (Zzt)  

2 Ohms

Product Status  

Active

Package  

Bulk

Mfr  

Microchip Technology

Factory Pack QuantityFactory Pack Quantity  

1

Manufacturer  

Microchip

Brand  

Microchip Technology

RoHS  

N

Package Description  

O-XALF-W2

Package Style  

LONG FORM

Package Body Material  

UNSPECIFIED

Operating Temperature-Min  

-65 °C

Reflow Temperature-Max (s)  

NOT SPECIFIED

Reference Voltage-Nom  

10 V

Operating Temperature-Max  

175 °C

Rohs Code  

No

Manufacturer Part Number  

UZ5810

Power Dissipation (Max)  

5 W

Package Shape  

ROUND

Number of Elements  

1

Part Life Cycle Code  

Active

Ihs Manufacturer  

DIGITRON SEMICONDUCTORS

Forward Voltage-Max (VF)  

1.35 V

Risk Rank  

5.86

Operating Temperature  

-65°C ~ 175°C

Series  

-

Packaging  

Bulk

Tolerance  

±10%

JESD-609 Code  

e0

Terminal Finish  

Tin/Lead (Sn/Pb)

Max Operating Temperature  

175 °C

Min Operating Temperature  

-65 °C

Subcategory  

Diodes & Rectifiers

Max Power Dissipation  

5 W

Technology  

ZENER

Terminal Position  

AXIAL

Terminal Form  

WIRE

Peak Reflow Temperature (Cel)  

NOT SPECIFIED

Reach Compliance Code  

unknown

JESD-30 Code  

O-XALF-W2

Polarity  

UNIDIRECTIONAL

Configuration  

SINGLE

Element Configuration  

Single

Diode Type  

ZENER DIODE

Current - Reverse Leakage @ Vr  

75 μA @ 7.6 V

Case Connection  

ISOLATED

Power - Max  

5 W

Max Reverse Leakage Current  

75 µA

Voltage - Zener (Nom) (Vz)  

10 V

Zener Voltage  

10 V

Product Type  

Zener Diodes

Voltage Tol-Max  

10%

Working Test Current  

125 mA

Reverse Current-Max  

75 µA

Dynamic Impedance-Max  

2 Ω

Reverse Test Voltage  

7.2 V

Voltage Temp Coeff-Max  

7 mV/°C

Product Category  

Zener Diodes

Radiation Hardening  

No