Mounting Type  

Surface Mount

Package / Case  

Die

Surface Mount  

YES

Supplier Device Package  

Die

Diode Element Material  

SILICON

Number of Terminals  

1

Mfr  

Microchip Technology

Package  

Tape & Reel (TR)

Product Status  

Active

Impedance (Max) (Zzt)  

16 Ohms

Factory Pack QuantityFactory Pack Quantity  

1

Manufacturer  

Microchip

Brand  

Microchip Technology

Package Description  

DIE-1

Package Style  

UNCASED CHIP

Package Body Material  

UNSPECIFIED

Reflow Temperature-Max (s)  

NOT SPECIFIED

Reference Voltage-Nom  

16 V

Operating Temperature-Max  

200 °C

Rohs Code  

No

Manufacturer Part Number  

CD3025B

Power Dissipation (Max)  

1 W

Package Shape  

SQUARE

Number of Elements  

1

Part Life Cycle Code  

Active

Ihs Manufacturer  

MICROSEMI CORP

Risk Rank  

5.61

Part Package Code  

DIE

Series  

-

Operating Temperature  

-65°C ~ 175°C

Tolerance  

±5%

JESD-609 Code  

e0

Pbfree Code  

No

ECCN Code  

EAR99

Terminal Finish  

TIN LEAD

HTS Code  

8541.10.00.50

Subcategory  

Diodes & Rectifiers

Technology  

ZENER

Terminal Position  

UPPER

Terminal Form  

NO LEAD

Peak Reflow Temperature (Cel)  

NOT SPECIFIED

Reach Compliance Code  

unknown

Pin Count  

1

JESD-30 Code  

S-XUUC-N1

Qualification Status  

Not Qualified

Polarity  

UNIDIRECTIONAL

Configuration  

SINGLE

Diode Type  

ZENER DIODE

Current - Reverse Leakage @ Vr  

500 nA @ 12.2 V

Voltage - Forward (Vf) (Max) @ If  

1.2 V @ 200 mA

Power - Max  

1 W

Voltage - Zener (Nom) (Vz)  

16 V

Product Type  

Zener Diodes

Voltage Tol-Max  

20%

Working Test Current  

15.5 mA

Dynamic Impedance-Max  

16 Ω

Product Category  

Zener Diodes