Surface Mount  

YES

Number of Terminals  

8

Package Description  

4.40 MM, LEAD FREE, PLASTIC, MO-153, TSSOP-8

Package Style  

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Moisture Sensitivity Levels  

1

Number of Words Code  

256

Package Body Material  

PLASTIC/EPOXY

Package Equivalence Code  

TSSOP8,.25

Reflow Temperature-Max (s)  

40

Operating Temperature-Max  

70 °C

Rohs Code  

Yes

Manufacturer Part Number  

24C02C/ST

Clock Frequency-Max (fCLK)  

0.4 MHz

Number of Words  

256 words

Supply Voltage-Nom (Vsup)  

5 V

Package Code  

TSSOP

Package Shape  

RECTANGULAR

Manufacturer  

Microchip Technology Inc

Part Life Cycle Code  

Active

Ihs Manufacturer  

MICROCHIP TECHNOLOGY INC

Risk Rank  

5.13

Part Package Code  

TSSOP

JESD-609 Code  

e3

Pbfree Code  

Yes

ECCN Code  

EAR99

Terminal Finish  

Matte Tin (Sn)

HTS Code  

8542.32.00.51

Subcategory  

EEPROMs

Technology  

CMOS

Terminal Position  

DUAL

Terminal Form  

GULL WING

Peak Reflow Temperature (Cel)  

260

Number of Functions  

1

Terminal Pitch  

0.65 mm

Reach Compliance Code  

compliant

Pin Count  

8

JESD-30 Code  

R-PDSO-G8

Qualification Status  

Not Qualified

Supply Voltage-Max (Vsup)  

5.5 V

Power Supplies  

5 V

Temperature Grade  

COMMERCIAL

Supply Voltage-Min (Vsup)  

4.5 V

Operating Mode  

SYNCHRONOUS

Supply Current-Max  

0.003 mA

Organization  

256X8

Seated Height-Max  

1.1 mm

Memory Width  

8

Standby Current-Max  

0.00005 A

Memory Density  

2048 bit

Parallel/Serial  

SERIAL

Memory IC Type  

EEPROM

Serial Bus Type  

I2C

Endurance  

1000000 Write/Erase Cycles

Write Cycle Time-Max (tWC)  

1 ms

Data Retention Time-Min  

200

Write Protection  

HARDWARE

I2C Control Byte  

1010DDDR

Width  

3 mm

Length  

4.4 mm