Mounting Type  

Surface Mount

Package / Case  

SC-70, SOT-323

Surface Mount  

YES

Supplier Device Package  

SOT-323

Diode Element Material  

SILICON

Number of Terminals  

3

Current - Average Rectified (Io) (per Diode)  

225mA (DC)

Package Description  

SOT-323, 3 PIN

Package Style  

SMALL OUTLINE

Package Body Material  

PLASTIC/EPOXY

Operating Temperature-Min  

-65 °C

Operating Temperature-Max  

150 °C

Manufacturer Part Number  

CMSD2005STR

Power Dissipation (Max)  

0.275 W

Package Shape  

RECTANGULAR

Manufacturer  

Central Semiconductor Corp

Number of Elements  

2

Part Life Cycle Code  

Active

Ihs Manufacturer  

CENTRAL SEMICONDUCTOR CORP

Forward Voltage-Max (VF)  

1.25 V

Risk Rank  

5.43

Series  

--

Packaging  

Tape & Reel (TR)

JESD-609 Code  

e0

Part Status  

Active

ECCN Code  

EAR99

Terminal Finish  

TIN LEAD

Applications  

HIGH VOLTAGE

HTS Code  

8541.10.00.70

Terminal Position  

DUAL

Terminal Form  

GULL WING

Reach Compliance Code  

compliant

Pin Count  

3

JESD-30 Code  

R-PDSO-G3

Qualification Status  

Not Qualified

Configuration  

SERIES CONNECTED, 2 ELEMENTS

Speed  

Fast Recovery = 200mA (Io)

Diode Type  

Standard

Current - Reverse Leakage @ Vr  

100nA @ 280V

Voltage - Forward (Vf) (Max) @ If  

1.25V @ 20A

Operating Temperature - Junction  

-65°C ~ 150°C

Output Current-Max  

0.225 A

Voltage - DC Reverse (Vr) (Max)  

300V

Number of Phases  

1

Rep Pk Reverse Voltage-Max  

350 V

Non-rep Pk Forward Current-Max  

4 A

Diode Configuration  

1 Pair Series Connection

Reverse Current-Max  

0.1 µA

Breakdown Voltage-Min  

350 V

Reverse Recovery Time-Max  

0.05 µs

Reverse Test Voltage  

280 V

Reverse Recovery Time (trr)  

50ns