Mounting Type  

Surface Mount

Package / Case  

8-TSSOP, 8-MSOP (0.118, 3.00mm Width)

Surface Mount  

YES

Supplier Device Package  

8-TSSOP

Number of Terminals  

8

Package  

Bulk

Base Product Number  

MC10EP89

Mfr  

onsemi

Product Status  

Active

Package Description  

TSSOP-8

Package Style  

SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

Moisture Sensitivity Levels  

NOT SPECIFIED

Package Body Material  

PLASTIC/EPOXY

Operating Temperature-Min  

-40 °C

Supply Voltage-Nom  

3.3 V

Reflow Temperature-Max (s)  

30

Supply Voltage-Min  

3 V

Operating Temperature-Max  

85 °C

Manufacturer Part Number  

MC10EP89DTR2

Interface Standards  

GENERAL PURPOSE

Package Code  

TSSOP

Package Shape  

RECTANGULAR

Manufacturer  

Rochester Electronics LLC

Part Life Cycle Code  

Active

Ihs Manufacturer  

ROCHESTER ELECTRONICS LLC

Supply Voltage-Max  

5.5 V

Risk Rank  

5.14

Part Package Code  

SOIC

Series  

10EP

JESD-609 Code  

e0

Pbfree Code  

Yes

Type  

Driver

Terminal Finish  

TIN LEAD

Additional Feature  

CAN ALSO OPERATE WITH -3V TO -5.5V SUPPLY IN NECL MODE

Technology  

ECL

Voltage - Supply  

4.2V ~ 5.7V

Terminal Position  

DUAL

Terminal Form  

GULL WING

Peak Reflow Temperature (Cel)  

240

Number of Functions  

1

Terminal Pitch  

0.65 mm

Reach Compliance Code  

unknown

Pin Count  

8

JESD-30 Code  

R-PDSO-G8

Qualification Status  

COMMERCIAL

Temperature Grade  

INDUSTRIAL

Seated Height-Max  

1.1 mm

Differential Output  

YES

Protocol  

-

Input Characteristics  

DIFFERENTIAL

Interface IC Type  

LINE DRIVER

Number of Drivers/Receivers  

1/0

Driver Number of Bits  

1

Transmit Delay-Max  

0.37 ns

Width  

3 mm

Length  

3 mm