Package / Case  

Die

Supplier Device Package  

Die

ECCN (US)  

EAR99

HTS  

8542.33.00.01

Manufacturer Type  

MMIC Amplifier

Number of Channels per Chip  

1

Maximum Operating Frequency (MHz)  

26000

Typical Gain Flatness (dB)  

±0.25

Typical Power Gain (dB)  

18@20000MHz

Typical Output Power (dBm)  

20@20000MHz

Typical Output Intercept Point (dBm)  

36@20000MHz

Maximum Input Return Loss (dB)  

20(Typ)@20000MHz

Maximum Output Return Loss (dB)  

16(Typ)@20000MHz

Maximum Operating Supply Voltage (V)  

8

Maximum Single Supply Voltage (V)  

8

Maximum Supply Current (mA)  

150(Typ)@7V

Maximum Power Dissipation (mW)  

2400

Minimum Operating Temperature (°C)  

-55

Maximum Operating Temperature (°C)  

85

Supplier Package  

Die

Package Height  

0.1

Package Length  

3

Package Width  

1.3

PCB changed  

14

Pd - Power Dissipation  

2.4 W

Maximum Operating Temperature  

+ 85 C

Minimum Operating Temperature  

- 55 C

Factory Pack QuantityFactory Pack Quantity  

1

Mounting Styles  

SMD/SMT

NF - Noise Figure  

3.2 dB

P1dB - Compression Point  

20 dBm

Input Return Loss  

20 dB

Manufacturer  

Microchip

Brand  

Microchip Technology / Atmel

OIP3 - Third Order Intercept  

34 dBm

RoHS  

Details

Package  

Tray

Base Product Number  

MMA041

Mfr  

Microchip Technology

Product Status  

Active

Packaging  

Waffle

Series  

-

Part Status  

Active

Type  

Low Noise Amplifiers

Subcategory  

Wireless & RF Integrated Circuits

Technology  

GaAs

Voltage - Supply  

7V

Frequency  

0Hz ~ 26GHz

Pin Count  

14

Operating Frequency  

0 Hz to 26 GHz

Operating Supply Voltage  

7 V

Number of Channels  

1 Channel

Test Frequency  

12 GHz to 20 GHz

Current - Supply  

150 mA

Product Type  

RF Amplifier

Gain  

18 dB

RF Type  

General Purpose

Noise Figure  

2.5dB

P1dB  

22.5dBm

Power Supply Type  

Single

Product Category  

RF Amplifier

RoHS Status  

RoHS Compliant