Factory Lead Time  

15 Weeks

Contact Plating  

Copper, Silver, Tin

Mount  

Surface Mount

Mounting Type  

Surface Mount

Package / Case  

8-XFBGA, WLCSP

Memory Types  

Non-Volatile

Operating Temperature  

-40°C~85°C TA

Packaging  

Tape & Reel (TR)

Published  

2005

JESD-609 Code  

e1

Part Status  

Active

Moisture Sensitivity Level (MSL)  

3 (168 Hours)

Number of Terminations  

8

Terminal Finish  

Tin/Silver/Copper (Sn/Ag/Cu)

Additional Feature  

ALSO OPERATES AT 1.7 V AND 2.5 V AT 5 MHZ AND 10 MHZ RESPECTIVELY

Voltage - Supply  

1.7V~5.5V

Terminal Position  

BOTTOM

Number of Functions  

1

Supply Voltage  

5V

Terminal Pitch  

0.43mm

JESD-30 Code  

X-PBGA-B8

Qualification Status  

Not Qualified

Supply Voltage-Max (Vsup)  

5.5V

Power Supplies  

1.8/5V

Supply Voltage-Min (Vsup)  

4.5V

Interface  

SPI, Serial

Memory Size  

1Mb 128K x 8

Operating Mode  

SYNCHRONOUS

Access Time  

20 ns

Memory Format  

EEPROM

Memory Interface  

SPI

Organization  

128KX8

Memory Width  

8

Write Cycle Time - Word, Page  

5ms

Density  

1 Mb

Standby Current-Max  

0.000003A

Max Frequency  

20MHz

Serial Bus Type  

SPI

Endurance  

1000000 Write/Erase Cycles

Write Cycle Time-Max (tWC)  

5ms

Data Retention Time-Min  

100

Write Protection  

HARDWARE/SOFTWARE

Height Seated (Max)  

0.54mm

RoHS Status  

ROHS3 Compliant